JPH025599B2 - - Google Patents

Info

Publication number
JPH025599B2
JPH025599B2 JP56214590A JP21459081A JPH025599B2 JP H025599 B2 JPH025599 B2 JP H025599B2 JP 56214590 A JP56214590 A JP 56214590A JP 21459081 A JP21459081 A JP 21459081A JP H025599 B2 JPH025599 B2 JP H025599B2
Authority
JP
Japan
Prior art keywords
unit
chip
board
card
identification card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56214590A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58118297A (ja
Inventor
Masao Muramatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyodo Printing Co Ltd
Original Assignee
Kyodo Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyodo Printing Co Ltd filed Critical Kyodo Printing Co Ltd
Priority to JP56214590A priority Critical patent/JPS58118297A/ja
Publication of JPS58118297A publication Critical patent/JPS58118297A/ja
Publication of JPH025599B2 publication Critical patent/JPH025599B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Wire Bonding (AREA)
  • Credit Cards Or The Like (AREA)
JP56214590A 1981-12-31 1981-12-31 識別カ−ドの製造方法 Granted JPS58118297A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56214590A JPS58118297A (ja) 1981-12-31 1981-12-31 識別カ−ドの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56214590A JPS58118297A (ja) 1981-12-31 1981-12-31 識別カ−ドの製造方法

Publications (2)

Publication Number Publication Date
JPS58118297A JPS58118297A (ja) 1983-07-14
JPH025599B2 true JPH025599B2 (en]) 1990-02-02

Family

ID=16658231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56214590A Granted JPS58118297A (ja) 1981-12-31 1981-12-31 識別カ−ドの製造方法

Country Status (1)

Country Link
JP (1) JPS58118297A (en])

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0444381Y2 (en]) * 1985-12-27 1992-10-20
JPS62109973U (en]) * 1985-12-27 1987-07-13
JPS62114772U (en]) * 1986-01-10 1987-07-21
JPS62255193A (ja) * 1986-04-28 1987-11-06 イビデン株式会社 Ｉｃカ−ド用プリント配線板
JPH0517269Y2 (en]) * 1986-05-15 1993-05-10
JPH07123182B2 (ja) * 1986-05-20 1995-12-25 日立マクセル株式会社 半導体装置
JPH0524554Y2 (en]) * 1986-07-21 1993-06-22
JPS63209897A (ja) * 1987-02-25 1988-08-31 日本電気株式会社 メモリカ−ド
JPH07121629B2 (ja) * 1987-04-06 1995-12-25 三菱電機株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5226989B2 (en]) * 1973-05-18 1977-07-18
JPS5158068A (ja) * 1974-11-18 1976-05-21 Hitachi Ltd Jushifushigatahandotaisochi
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte

Also Published As

Publication number Publication date
JPS58118297A (ja) 1983-07-14

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